Technical characteristics of PCB electroplating production line:
Removal of adhesive residue/chemical deposition of copper, full board electroplating (primary copper), graphic electroplating (secondary copper), hole filling electroplating, nickel gold electroplating, chemical deposition of nickel gold, and gold finger electroplating
- Fully automatic intelligent open program.
- Beijiafu WCS driving positioning system.
- Automatic/manual top clamp.
- Thin plate frame system.
- Floating frame and push rod system.
- Bottom spray/side spray high flow nozzle.
- Anode screen and upper and lower cathode shielding.
- Automatic fluid tray for driving.
- Suspended anode swing bar.
- Vehicle maintenance platform.
- Automatic loading and unloading.
- Measuring cup type automatic addition system.
- Copper plated carbon treatment system.
- Full line closure














Reviews
There are no reviews yet.